高通公司与华为技术有限公司宣布达成专利授权协议1。根据协议，高通获得支撑华为新型逻辑折叠芯片制造技术的专利许可1。双方同时签署了长期、广泛的专利许可协议，涵盖5G、计算、人工智能、网络等多个技术领域1。
高通将收购华为在计算、人工智能、网络及其他技术领域的部分美国专利1。协议完成后，华为全部专利许可协议累计总金额预计将超过69亿美元1。该项合作也带动了市场反应，高通盘前股价最高涨超4%1。
华为逻辑折叠芯片晶体管密度提升55%，芯片面积小于前代产品1。
Qualcomm has secured patent licensing rights to Huawei's logical folding chip manufacturing technology under a newly announced agreement between the two companies 1. The licensing deal covers Huawei's innovations in logical folding chip architecture, enabling Qualcomm to utilize patents supporting this advanced manufacturing approach 1.
Beyond the specific chip technology license, Qualcomm and Huawei have also established a broad, long-term cross-patent licensing agreement spanning multiple technology domains including 5G, computing, artificial intelligence, and networking 1. As part of this arrangement, Qualcomm will acquire a portion of Huawei's United States patents in computing, artificial intelligence, network, and other technology fields 1. Following completion of this agreement, Huawei's cumulative total revenue from all patent licensing agreements is projected to exceed $6.9 billion 1.
Huawei's logical folding chip technology demonstrates a 55 percent increase in transistor density while reducing physical area compared to its predecessor generation 1. The market responded positively to the announcement, with Qualcomm's pre-market stock price rising as much as 4 percent 1.
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