华为全球首款逻辑折叠芯片麒麟9050 Pro线下展出

华为于10月12日在上海练秋湖举办的终端创新技术沟通会上线下展出全球首款逻辑折叠芯片麒麟9050 Pro1。该芯片搭载于Mate XT 2三折叠手机1，集成灵犀CPU、马良GPU和达芬奇架构NPU1，是华为时隔六年在旗舰发布会上推出的全新麒麟芯片1。

在性能配置方面，麒麟9050 Pro的马良GPU实现了计算单元与缓存翻倍1，NPU支持在端侧部署30B参数的混合专家架构大模型1。搭载该芯片的终端产品性能均有显著提升，其中Mate 90 Pro Max整机性能相比上代提升31%，Mate 90 Pro提升20%，Mate 90标准版提升27%1。麒麟9050 Pro已于9月7日随Mate XT 2三折叠手机首发亮相1。

Huawei unveiled the world's first logic-folding τ chip, the Kirin 9050 Pro, at an offline terminal innovation technology communication conference held in Shanghai on October 121. The processor powers the Mate XT 2 Ultimate Design tri-fold smartphone and represents Huawei's first flagship new Kirin chip release in six years1.

The Kirin 9050 Pro integrates the Lingxi CPU, Maliang GPU, and DaVinci architecture NPU1. The Maliang GPU features doubled computing units and cache capacity1, while the NPU supports on-device deployment of 30-billion-parameter mixture-of-experts large language models1. Performance improvements across Huawei's lineup are notable: the Mate 90 Pro Max achieved a 31 percent overall device performance boost, the Mate 90 Pro saw a 20 percent increase, and the standard Mate 90 delivered a 27 percent enhancement1.

The Kirin 9050 Pro was initially introduced alongside the Mate XT 2 tri-fold phone on September 71.