华为宣布加快其下一代AI芯片的上市步伐，计划在2027年第一季度推出昇腾960DT芯片，较之前规划的第三季度大幅提前1。该芯片将集成到华为的Peerium计算架构中，用于与英伟达在AI芯片领域展开竞争1。
华为在Connect大会上宣布了这一时间调整1。Atlas 950 SuperCluster可支持连接多达256,000个加速器卡1。不过，虽然芯片推出时间显著提前，但首批系统的规模相比原计划有所缩减——原定包含15,488个昇腾960芯片的系统现已调整为仅包含4,096个芯片1。
Huawei has moved up the release of its next-generation Ascend 960DT AI chip to the first quarter of 2027, significantly ahead of its previously planned third-quarter launch that year 1. The announcement was made by David Wang at the Huawei Connect conference 1. The chip will power Huawei's Peerium computing architecture as the company seeks to compete with Nvidia's dominance in the AI chip sector 1.
The accelerated timeline comes with a notable trade-off: the initial system deployment will be substantially smaller than originally envisioned 1. While the company had initially planned to deploy systems containing 15,488 Ascend 960 chips, the system announced this week will include only 4,096 chips 1. The Atlas 950 SuperCluster is capable of connecting up to 256,000 accelerator cards 1.
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