华为推出新一代芯片麒麟9050 Pro，首次采用逻辑折叠架构，实现了芯片从平面向3D立体结构的转变 1。该芯片在两层裸芯片之间形成高密度垂直互联，约5000万个连接点，其中500万到1000万个用于信号通信，远超传统3D封装中几万至几十万级别的连接规模 1。搭载该芯片的华为Mate XT 2整机性能较上一代提升42% 1。
华为半导体首席科学家廖恒介绍了新芯片的垂直互联设计原理 1。业界专家认为这项技术突破为全球集成电路产业打开了新思路 1。中国科学院院士褚君浩表示，该技术通过"时间缩微"实现创新路线 1，未来有望应用于多领域终端和服务器 1。这是华为继Mate 40发布会之后时隔六年在旗舰发布会上推出的全新麒麟芯片 1。
Huawei unveiled its next-generation Kirin 9050 Pro processor, featuring a pioneering logical folding architecture that transforms chip design from flat to three-dimensional structure 1. The innovation introduces high-density vertical interconnections between two chiplet layers, with approximately 50 million connection points—substantially exceeding the tens of thousands to hundreds of thousands of interconnects found in conventional 3D packaging approaches 1.
Among the approximately 50 million total connections between the two chiplet layers, between 5 million and 10 million are dedicated to signal communication 1. Huawei's semiconductor chief scientist Liao Heng elaborated on the vertical interconnect design of the new chip 1, while Chinese Academy of Sciences academician Zhu Junhao characterized the technology as achieving an innovative pathway through "temporal miniaturization" 1. The Kirin 9050 Pro marks Huawei's first new flagship processor unveiled at its annual launch event in six years, following the Mate 40 presentation 1. The Mate XT 2 smartphone powered by this architecture demonstrates a 42 percent overall performance improvement compared to its predecessor 1. Industry observers anticipate that this breakthrough architecture may eventually extend across terminals and server applications in diverse sectors 1.
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