华为于10月13日在上海举办麒麟媒体沟通会，首次公布麒麟9050 Pro芯片的详细架构图1。该芯片集成了灵犀CPU、马良GPU、达芬奇架构NPU、麒麟AI ISP、Balong AI Modem等多个处理模块1。其中马良GPU性能提升40%，同时搭载业界首个2亿高像素融合ISP1。
华为半导体业务部长徐松余透露，下一代麒麟2027芯片已就绪，所有测试结果符合预期1。徐松余表示，未来10年的芯片演进方案具有可持续性1。
Huawei unveiled detailed architectural specifications for its Kirin 9050 Pro processor during a media briefing held in Shanghai on October 13, 2024, while revealing that the successor Kirin 2027 chip is already prepared 1. The presentation marked the first public disclosure of the Kirin 9050 Pro's component architecture, which integrates multiple processing modules including the Lingxi CPU, Maliang GPU, Davinchi architecture NPU, Kirin AI ISP, and Balong AI Modem 1.
Xu Songyu, head of Huawei's semiconductor business division, disclosed that the Kirin 2027 chip has completed development with all testing results meeting expectations 1. He emphasized that the company's roadmap for chip evolution over the next decade, based on logical iteration principles, demonstrates sustainable technical progression 1. The Kirin 9050 Pro features a 40 percent performance improvement in its Maliang GPU and incorporates the industry's first 200-megapixel fused ISP technology 1.
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