华为常务董事余承东通过视频披露，华为半导体已在手机、AI、通用计算、网络、智能汽车等多个领域成功设计并量产381款τ芯片1。
为应对芯片制程微缩的物理极限，华为提出了"韬（τ）定律"作为半导体演进的新指导原则1。该原则的核心创新在于以"时间缩微"替代传统的"几何缩微"策略，通过逻辑折叠等创新技术压缩信号传播时延，从而在性能、能效和晶体管密度方面实现持续提升1。按照这一新原则的演进路径，华为预计到2031年，基于韬定律设计的高端芯片晶体管密度将达到1.4纳米制程的同等水平1。
Huawei Executive Director Yu Chengdong revealed in a video statement that the company has successfully designed and mass-produced 381 tau (τ) chips across smartphones, artificial intelligence, general-purpose computing, networking, and intelligent vehicles1. The announcement underscores Huawei's advancing capabilities in semiconductor development.
Central to Huawei's innovation strategy is the introduction of the "Tau Law" as a new guiding principle for semiconductor evolution1. Rather than relying solely on traditional geometric scaling, this approach emphasizes "temporal compression" to reduce signal propagation delays through techniques such as logic folding1. By implementing multi-level collaborative optimization across the device, circuit, chip, and system layers, Huawei aims to achieve continuous improvements in performance, energy efficiency, and transistor density1.
Looking forward, the company projects that by 2031, high-end chips developed under the Tau Law will achieve transistor density equivalent to that of 1.4-nanometer process technology1.
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