美国研究机构科技与国家治理能力中心发布报告称，中国晶圆厂截至2026年初预计已获得343台浸润式DUV微影系统，其中270台来自荷兰ASML公司的Twinscan NXT:1980i系统1。该报告指出，2024年及2025年间，中国晶圆厂在这类设备上的支出超过130亿美元1。
浸润式DUV技术经调整后可用于制造7纳米逻辑芯片及高阶存储器1。报告认为现行出口管制存在漏洞，建议全面禁止向中国出口浸润式DUV设备，并限制相关零件供应与维修服务1。荷兰于2023年9月起规定出口NXT:2000i及以上型号需获许可证，后来也对NXT:1980i系统实施许可证要求但允许逐案批准1。
A U.S. research institution has released findings documenting China's acquisition of advanced semiconductor manufacturing equipment and recommending stricter export restrictions. The Center for Technology and Governance has reported that Chinese wafer fabrication plants are estimated to have obtained 343 immersion DUV lithography systems as of early 2026, with 270 of those units coming from Dutch manufacturer ASML.1 The systems in question are ASML's Twinscan NXT:1980i models, for which Chinese foundries spent over $13 billion in combined purchases during 2024 and 2025.1
The report underscores the dual-use potential of this technology, noting that immersion DUV systems can be modified to manufacture 7-nanometer logic chips and advanced memory products.1 Current export control frameworks contain gaps: the Netherlands has required export licenses for NXT:2000i models and higher since September 2023, but later extended licensing requirements to the NXT:1980i while permitting case-by-case approvals.1 The U.S. research center recommends a comprehensive ban on exporting immersion DUV equipment to China, along with restrictions on related components and maintenance services.1
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