礼鼎半导体科技第二园区先进IC载板数智化制造基地于9月19日在深圳宝安落地 1。该项目计划总投资不低于120亿元 1，重点布局FCBGA等IC载板产品，面向人工智能、高性能计算等应用领域 1。
项目的推进速度引人瞩目。相关部门通过优化审批流程，使得市级产业遴选全流程仅耗时10天完成，一期用地挂牌也在20天内落成 1。作为臻鼎科技集团布局高端IC载板赛道的核心平台，礼鼎半导体成立于2019年 1，其FCBGA载板产品已完成2nm工艺客户认证 1。
该项目的落地为深圳制造业向高端封装领域延伸提供了支撑 1。宝安拥有135家以上PCB产业链企业 1，为该项目的建设和运营提供了产业生态基础。
Liding Semiconductor Technology's second industrial park, an advanced IC substrate intelligent manufacturing base, was officially established in Shenzhen's Baoan District on September 19, marking a significant expansion in the city's high-end packaging sector.1 The project carries a minimum total investment of 120 billion yuan and will focus on developing FCBGA and other IC substrate products targeting artificial intelligence and high-performance computing applications.1
The project exemplifies streamlined government processes, having completed the municipal industrial screening in just 10 days and finished the first phase land auction within 20 days.1 Liding Semiconductor, established in 2019 as the core platform for Zhen Ding Technology Group's advanced IC substrate initiatives, has achieved customer certification for FCBGA substrates at the 2-nanometer process level.1 The Baoan District provides a robust industrial foundation for the venture, hosting over 135 companies in the PCB supply chain ecosystem.1
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