小米CEO雷军回应新华社报道，宣布公司未来5年计划投入2000亿元研发费用1。此举旨在加强底层技术自研，为科技创新打开更广阔空间。小米已累计投入超过210亿元进行芯片自研1，并已组建近3000人的芯片专家团队1。
在芯片产品方面，小米推出了玄戒系列三款新芯片1。其中玄戒O3是AI旗舰SoC芯片，在安兔兔测试中首次突破500万分1；玄戒O100是高带宽AI加速芯片，带宽达1.22TB/s1；玄戒D100为国内首款3nm智驾高算力AI芯片1。小米澎程系列新车于9月7日发布，起售价为20.99万元1。
Xiaomi CEO Lei Jun responded to a Xinhua News Agency report by unveiling the company's ambitious research and development strategy, committing to invest 200 billion yuan in R&D over the next five years.1 The announcement underscores Xiaomi's focus on advancing core technologies and expanding innovation capabilities.
The company has already invested over 21 billion yuan cumulatively in chip research and development, building a specialized team of approximately 3,000 chip experts.1 This foundation has enabled Xiaomi to successfully develop three new chipsets: the Xuanwu O3, an AI flagship system-on-chip that achieved the first Antutu score exceeding 5 million; the Xuanwu O100, a high-bandwidth AI acceleration chip with 1.22TB/s performance; and the Xuanwu D100, China's first 3nm autonomous driving AI computing chip.1 Xiaomi also introduced the Pengcheng series of vehicles on September 7, with pricing starting at 209,900 yuan.1
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