英国AI材料公司CuspAI于7月20日完成4.5亿美元B轮融资，估值达26亿美元，由Kleiner Perkins和New Enterprise Associates领投，贝索斯旗下Bezos Expeditions、AMD Ventures和三星投资等参投1。CuspAI开发的MIRA系统采用逆向设计思路，通过人工智能帮助科学家从海量材料结构中筛选最有前景的候选方案，曾从约300万亿种潜在材料结构中筛选出20种进入开发1。
同时，CuspAI宣布成立AI Materials Foundry，已吸引英伟达、Meta、Applied Materials和现代汽车集团等超过45家企业合作伙伴参与1。这一平台旨在建立多产业共用的材料研发基础设施，CuspAI目前已与芬兰化工企业Kemira等展开新材料应用合作1。
British artificial intelligence materials company CuspAI completed a $450 million Series B funding round on July 20, 2024, valuing the company at $2.6 billion 1. Bezos Expeditions, the investment vehicle of Amazon founder Jeff Bezos, participated in the round alongside lead investors Kleiner Perkins and New Enterprise Associates, with additional backing from AMD Ventures and Samsung Ventures 1.
The funding will support CuspAI's mission to revolutionize materials science through artificial intelligence. The company's MIRA system employs a reverse-engineering approach, enabling scientists to identify the most promising material candidates from vast databases of potential molecular structures 1. In one application, MIRA narrowed down approximately 3 trillion potential material structures to just 20 viable candidates for development 1. CuspAI has already begun collaborating with companies like Finnish chemical manufacturer Kemira to explore real-world applications of AI-discovered materials 1.
Alongside the funding announcement, CuspAI launched the AI Materials Foundry, a collaborative research platform that has attracted more than 45 industry partners including NVIDIA, Meta, Applied Materials, and Hyundai Motor Group 1. The initiative aims to establish a shared materials research and development infrastructure accessible across multiple industrial sectors 1.
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