AI芯片供应链正经历深层变革。[1]英伟达、美光、SK海力士、三星等行业巨头通过预付款、长期协议和保证金等方式，提前锁定未来三到五年的晶圆代工、高带宽内存（HBM）、先进封装等关键产能。[1]这种"预付款时代"改变了行业生态，提高了中小芯片公司的竞争门槛，同时推动了半导体融资模式的变革。[1]
英伟达在产能锁定上动作最大。[1]该公司披露的制造、供应和产能采购承诺达到1190亿美元，其中950亿美元将在当前财年剩余时间支付。[1]英伟达与先进封装商Amkor签署了总价值15亿美元的多年期先进封装与技术开发协议。[1]美光已与客户签署16份照付不议战略客户协议，剩余履约义务约为1000亿美元，协议预计带来220亿美元现金保证金及相关财务承诺，其中约180亿美元是现金保证金。[1]
其他芯片制造商和合作伙伴也在积极扩展产能承诺。[1]SK海力士已与约10家客户完成长期供货协议，通常为5年期限。[1]三星与博通签署合作备忘录，计划在未来五年至2030年扩大合作规模至超过2000亿美元。[1]台积电将2026年资本开支上调至600亿至640亿美元，其中10%至20%用于先进封装、测试、掩膜等环节。[1]AI芯片产能也从单点扩展到了一整套AI芯片制造体系。[1]
The artificial intelligence chip supply chain is undergoing a fundamental transformation as leading semiconductor firms shift from traditional transactional relationships to strategic asset acquisition through long-term commitments.[1] Companies including NVIDIA, Micron, SK Hynix, and Samsung are securing production capacity years in advance through advance payments, multi-year contracts, and financial guarantees that reshape competitive dynamics across the industry.[1]
NVIDIA has committed to manufacturing, supply, and capacity purchases totaling $119 billion, with $95 billion scheduled to be paid during the remainder of its current fiscal year.[1] The company has also entered into a multi-year advanced packaging and technology development agreement with Amkor valued at $1.5 billion.[1] Micron has signed sixteen strategic customer agreements with remaining obligations of approximately $100 billion, supported by $220 billion in cash guarantees and related financial commitments, of which roughly $180 billion represents direct cash deposits.[1] SK Hynix has completed long-term supply agreements with approximately ten customers, typically spanning five years.[1] Samsung and Broadcom have signed a memorandum of understanding targeting expansion of their partnership to exceed $200 billion over the next five years through 2030.[1]
This capacity-locking strategy extends beyond individual chip producers to encompass the entire manufacturing ecosystem.[1] Taiwan Semiconductor Manufacturing Company has raised its 2026 capital expenditure guidance to between $60 billion and $64 billion, allocating 10 to 20 percent toward advanced packaging, testing, and photomask production.[1] The shift toward advance commitments and prepayment models raises barriers to entry for smaller chip companies while simultaneously driving evolution in semiconductor financing practices across the industry.[1]