华为何刚详解 Mate 90 系列 τ 芯片：逻辑折叠技术驱动性能大幅跃升

在10月28日举行的“双十一焕新季·全场景新品发布会”上，华为董事、终端BG CEO 何刚正式介绍了Mate 90系列手机及其核心组件麒麟9050系列芯片1。何刚重点揭秘了该芯片采用的“逻辑折叠”技术，指出这一创新设计实现了性能的跨越式提升1。

根据披露的数据，不同型号的整机性能较上一代均有显著增长：Mate 90 Pro Max提升幅度最大，达到31%；Mate 90标准版提升了27%；而Mate 90 Pro则提升了20%1。在硬件规格方面，麒麟9050集成了灵犀CPU、马良GPU和达芬奇架构NPU，其中马良GPU的计算单元与缓存均实现翻倍1。此外，该芯片的AI能力也得到增强，其NPU支持在端侧部署拥有30B参数的混合专家架构大模型1。

Huawei officially introduced the Mate 90 smartphone series and its core component, the Kirin 9050 chip family, during a full-scenario new product launch event held on October 28 1. He Gang, a Huawei director and CEO of the Terminal Business Group, served as the primary speaker, detailing how the new processor leverages "logic folding" technology to achieve significant leaps in performance 1.

The integration of logic folding has resulted in measurable improvements across the lineup, with the Mate 90 Pro Max delivering a 31% boost in overall system performance compared to its predecessor 1. The standard Mate 90 model offers a 27% increase, while the Mate 90 Pro sees a 20% improvement over the previous generation 1. Beyond raw processing power, the Kirin 9050 series incorporates the Lingxi CPU, Ma Liang GPU, and Da Vinci architecture NPU 1. Notably, the Ma Liang GPU features doubled computing units and cache capacity, enhancing graphical throughput 1. On the artificial intelligence front, the NPU is capable of deploying large models with up to 30 billion parameters in a mixture-of-experts architecture directly on-device 1.