10月28日，在华为双十一焕新季发布会上，华为董事、终端 BG CEO 何刚披露了麒麟芯片回归背后的历程 1。何刚指出，自2020年起受外部因素影响，华为一度无法获取先进要素，导致芯片发展面临严峻考验 1。经过全产业链的不懈奋斗，华为于2023年在 Mate 60 系列上成功实现了麒麟芯片的回归 1。
对于即将发布的新一代芯片，何刚给予高度评价，称麒麟 9030 系列是“半导体平面电路设计的巅峰之作” 1。同时，他透露今年的麒麟 9050 系列将成为“全球首款逻辑折叠 τ 芯片” 1。此外，文章回顾了华为展示供应链自主可控能力的过程：2025年8月，Pura 80 在更新 HarmonyOS 后开始显示麒麟处理器型号；同年9月，Mate XTs 正式官宣搭载麒麟 9020 1。
During Huawei’s Double 11 Refresh Season launch event on October 28, He Gang, a director of the company and CEO of its Terminal Business Group, detailed the journey behind the return of Kirin chips to consumer devices 1. He Gang emphasized that this achievement was made possible through relentless efforts across the entire industrial chain, overcoming significant external challenges that had prevented access to advanced elements since 2020 1. The turning point occurred in 2023 with the Mate 60 series, which marked the official reintroduction of Kirin processors into the market 1.
Looking toward future technology, He Gang characterized the upcoming Kirin 9030 series as the pinnacle of planar circuit design in the semiconductor industry 1. In contrast, he described this year's Kirin 9050 series as the world's first logic-folding τ chip, representing a distinct architectural breakthrough 1. This commentary aligns with recent moves by Huawei to publicly disclose processor models to demonstrate supply chain autonomy, such as the Pura 80 displaying Kirin processor details after an August 2025 HarmonyOS update and the September 2025 official announcement of the Kirin 9020 for the Mate XTs 1.
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