深圳造"芯"，龙华突围：世界级"芯城"加速崛起

深圳龙华区正加速打造世界级半导体产业科技中心。2025年深圳集成电路产业销售收入达3610.4亿元，同比增长27.1%，其中设计业销售收入达2421.3亿元，占全国集成电路设计产值的29.3%1。在龙华区的推动下，检测量测、激光精密装备、先进封装等关键细分赛道实现了从跟跑向并跑的技术跨越1。

龙华区在集成电路检测设备领域已涌现出一批本土龙头企业。中科飞测2025年营业收入突破20亿元，研发费用达到6.6亿元，产品累计出货超1500台，服务客户超300家1。埃芯半导体从2023年首台晶圆量测设备交付到2026年累计出货突破百台，订单规模达到数亿元1。微见智能2026年上半年存储芯片封装设备同比增长超500%，光传输芯片封装设备增长超300%1。这些产品已广泛应用于国内晶圆厂。

龙华区的产业集聚效应显著。2025年半导体与集成电路集群产出规模达到224.25亿元，集聚规上企业200家、专精特新企业141家、国家级专精特新小巨人企业24家1。2026年5月《深圳市国民经济和社会发展第十五个五年规划纲要》赋予龙华区打造世界半导体产业科技中心的使命，并划定约200平方公里跨区域协同发展范围1。

龙华区仍面临现实挑战。区内中小微企业占比超85%，缺少海思、中芯国际量级的超大龙头，晶圆制造环节存在空白1。龙华正通过系统思维推动产业链补链强链，以弥补这些短板。

Longhua District in Shenzhen is rapidly establishing itself as a world-class semiconductor technology center, achieving a technological leap from following to keeping pace with global competitors in key segments including inspection and metrology, laser precision equipment, and advanced packaging 1. The district has become home to leading domestic integrated circuit testing equipment manufacturers such as CyPhy Tech and Acema Semiconductor, whose products are widely deployed across domestic wafer fabs 1.

In 2025, Shenzhen's integrated circuit industry generated sales revenue of 361.04 billion yuan, representing a 27.1% year-over-year increase, with design sector revenue reaching 242.13 billion yuan and accounting for 29.3% of national integrated circuit design output 1. The Shenzhen Municipal 15th Five-Year Plan issued in May 2026 designated Longhua with the mission to build a world semiconductor technology center, establishing a cross-regional collaborative development scope of approximately 200 square kilometers 1. Longhua's semiconductor and integrated circuit cluster produced 22.425 billion yuan in output in 2025, concentrating over 200 large-scale enterprises, 141 specialized and innovative enterprises, and 24 national-level specialized and innovative "little giant" enterprises 1.

Major local companies demonstrate strong momentum across multiple segments. CyPhy Tech achieved operating revenue exceeding 2 billion yuan in 2025 with research and development expenses of 660 million yuan, accumulating shipments exceeding 1,500 units serving over 300 customers 1. Acema Semiconductor progressed from delivering its first wafer metrology equipment in 2023 to achieving cumulative shipments surpassing 100 units by 2026, with order scale reaching hundreds of millions of yuan 1. Microvision Intelligence saw storage chip packaging equipment sales surge over 500% in the first half of 2026, while optical transmission chip packaging equipment grew over 300% 1.

Despite these achievements, Longhua faces structural challenges. Small and medium-sized enterprises constitute over 85% of the district's semiconductor base, with an absence of super-large-scale enterprises comparable to HiSilicon or China's SMIC, and a complete gap in wafer manufacturing capacity 1.