华为于10月1日发布Mate 90系列旗舰手机，全系搭载麒麟τ芯片，其中包括麒麟9030（Mate 90）、麒麟9035（Mate 90 Pro）、麒麟9050（Mate 90 Pro Max）和麒麟9050 Pro（Mate 90 Pro Max/RS非凡大师）四款处理器，标志着华为四代麒麟τ芯片首次集体亮相1。麒麟9050 Pro成为首款采用逻辑折叠技术的τ芯片1。
余承东通过视频详细介绍了该代处理器的创新设计理念1。他表示，"芯片是手机的大脑，应用打开的快慢、游戏运行的稳定、照片/视频处理的好坏都离不开芯片"1。麒麟9050系列在一片指甲大小的芯片里集成了上百亿晶体管1。逻辑折叠技术将电路折叠起来并按逻辑关系分层布局，用高速通道进行连接1。
Huawei introduced its Mate 90 flagship smartphone series on October 1st, with all models equipped with Kirin processors featuring the company's τ chip architecture 1. The lineup includes the Kirin 9030 in the Mate 90, Kirin 9035 in the Mate 90 Pro, and Kirin 9050 variants in the Mate 90 Pro Max and Mate 90 Pro Max/RS Master Edition 1. This marked the first collective appearance of four generations of Kirin τ chips 1.
The flagship Kirin 9050 Pro represents the industry's first logical folding τ chip, introducing a novel design approach to semiconductor architecture 1. Through a video presentation, Yu Chengdong, Huawei's senior executive, explained the innovative design philosophy and performance improvements of this generation of processors 1. He emphasized that "chips serve as the brain of smartphones, directly influencing the speed of app launches, the stability of game performance, and the quality of photo and video processing" 1. The Kirin 9050 series packs hundreds of billions of transistors into a chip the size of a fingernail 1. The logical folding technology folds circuits and arranges them according to logical hierarchies, connecting them through high-speed channels 1.
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