华为于10月1日举办Mate 90系列及全场景新品发布会，常务董事余承东正式发布了新一代麒麟芯片产品线1。本次发布涵盖旗舰τ芯片（麒麟9030、9035）和逻辑折叠τ芯片（麒麟9050、9050 Pro）两大系列1，余承东宣布麒麟芯片开启"芯"纪元2。Mate 90全系搭载τ芯片1。
新发布的芯片性能提升显著。麒麟9030的CPU性能提升13%，GPU性能提升54%，NPU性能提升13%，整机性能提升27%1；麒麟9035的CPU性能提升11%，GPU性能提升10%，NPU性能提升51%，整机性能提升20%1。麒麟9050 Pro作为首款逻辑折叠芯片，支持9核16线程超线程技术，多核性能提升23%、GPU渲染性能提升40%、NPU性能提升140%，整机性能提升31%1。发布会现场还重温了《Dream It Possible》歌曲并回顾了历代Mate旗舰手机和海思麒麟处理器的发展历程2。
Huawei held its Mate 90 series launch event on October 1st, where executive director Yu Chengdong announced the introduction of the new generation Kirin tau chips, marking what the company describes as the beginning of a new "chip" era.12 The announcement included four new processors: the flagship tau chips comprising the Kirin 9030 and 9035, as well as the logic-folded tau chips consisting of the Kirin 9050 and 9050 Pro.12
The Kirin 9030 delivers CPU performance improvements of 13 percent, GPU enhancements of 54 percent, and NPU gains of 13 percent, while the Kirin 9035 achieves CPU improvements of 11 percent, GPU increases of 10 percent, and NPU boosts of 51 percent.1 The flagship Kirin 9050 Pro, positioned as the company's first logic-folded chip, supports nine-core 16-thread hyper-threading technology and demonstrates particularly impressive gains with multi-core performance improvements of 23 percent, GPU rendering performance enhancements of 40 percent, and NPU performance increases of 140 percent compared to its predecessor.1 In terms of overall device performance, the Kirin 9030 delivers a 27 percent improvement, the Kirin 9035 provides a 20 percent boost, and the Kirin 9050 Pro achieves a 31 percent enhancement.1 All Mate 90 models will be equipped with the new tau chips.1
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