华为终端Haco发布会已在文化和旅游部官网完成备案，定于9月23日在深圳国际会展中心20号馆举办[1]。
Mate 90系列作为华为旗舰手机产品，预计将搭载基于韬定律技术研发的新一代麒麟芯片[1]。这款芯片采用逻辑折叠技术，相比传统二维芯片设计，晶体管密度提升了53.5%，达到238 MTr/mm²，同时P核能效提升41%、峰值频率提升12.7%[1]。"韬定律"这一技术理念由华为消费者业务CEO何庭波在5月25日的2026国际电路与系统研讨会上首次提出[1]。
此外，华为还计划在9月上旬发布Mate XT2三折叠手机[1]。
Huawei's terminal division will hold a product launch event on September 23 at the Shenzhen International Convention and Exhibition Centre, Hall 20, according to a filing with China's Ministry of Culture and Tourism approved on August 10 [1]. The event is scheduled to introduce the Mate 90 series flagship smartphone alongside a new Kirin chip based on Tao's Law technology [1].
The upcoming Kirin processor is expected to deliver significant performance improvements over conventional two-dimensional chips, with transistor density increased by 53.5% to reach 238 MTr/mm² [1]. The new chip will feature logic folding technology and achieve P-core energy efficiency gains of 41%, while peak frequency will rise by 12.7% [1]. The Tao's Law design principle was first introduced by He Tingbo on May 25 at the 2026 International Circuits and Systems Symposium [1]. Huawei's product roadmap indicates the Mate XT2 foldable phone will debut in early September, followed by the Mate 90 series launch later that month [1].
