根据独立科技记者高灿鸣的报道，苹果公司正面临 iPhone 18 Pro 系列及 iPhone Ultra 折叠手机的量产困难[1]。DRAM 芯片供应不足成为主要瓶颈，导致台积电为苹果代工的 A20 Pro 芯片产能受限，大量芯片已堆积在仓库中[1]。距离 2026 年秋季新品发布会还有不到 6 周时间[1]。
A20 Pro 芯片采用移动版 CoWoS 封装工艺和 WMCM 封装方案，将 DRAM 内存移至芯片封装侧面而非堆叠在芯片顶部[1]。为应对 DRAM 供应不足，苹果主要依赖美光科技，同时紧急从 SK 海力士和三星采购[1]，并考虑将中国长鑫存储纳入供应链[1]。目前台积电的封装工作仍未能推进，A20 Pro 芯片的 CPU 部分持续堆积[1]。
Apple has launched an emergency procurement campaign for DRAM memory chips to address supply constraints affecting the production of its upcoming iPhone 18 Pro, iPhone 18 Pro Ultra, and iPhone Ultra folding device [1]. According to independent tech reporter Gao Canming, insufficient DRAM supply has created a bottleneck in Taiwan Semiconductor Manufacturing Company's (TSMC) manufacturing capacity for Apple's A20 Pro chip, with completed CPU components accumulating in warehouses [1].
The production challenge stems from Apple's architectural redesign of the A20 Pro chip, which relocates DRAM memory to the side of the chip package rather than stacking it atop the processor [1]. The chip employs a mobile version of CoWoS packaging technology alongside WMCM packaging solutions [1]. With the autumn 2026 product launch event less than six weeks away, Apple is diversifying its DRAM supply sources beyond its primary vendor Micron Technology, now urgently purchasing from SK Hynix and Samsung [1]. The company is also evaluating the integration of China's Changxin Storage into its supply chain [1].
