小米 18 Fold 折叠屏手机首发玄戒 O3 芯片，9 月正式上市

小米正式发布玄戒 O3 芯片，这是专为最高端产品打造的 AI 旗舰 SoC1。该芯片安兔兔跑分达到 522 万分，成为首个突破 500 万分的旗舰芯片1。其中，CPU 采用十核全大核设计，多核跑分首次突破 15000 分，性能相比上一代提升 60%；GPU 首发搭载 G2-Ultra NX 图形处理器，性能提升 85%，功耗降低 64%1。

玄戒 O3 在存储及 AI 能力上也实现突破1。该芯片是全球首个支持 LPDDR6 的移动处理器，内存带宽高达 113.8GB/s，相比玄戒 O1 提升 48%1。NPU 拥有 200TOPS 张量算力和 3.13TFLOPS 向量算力，端侧 AI 性能提升 45%1。小米 18 Fold 折叠屏手机将首发搭载玄戒 O3，预计 9 月正式上市1，同时小米平板 9 Pro Max 也将同步搭载该芯片1。

Xiaomi has officially unveiled the Xuanwu O3 chip, a flagship AI-focused system-on-chip engineered for premium devices 1. The processor achieved an AnTuTu benchmark score of 5.22 million points, marking the first flagship SoC to surpass the 5 million-point threshold 1.

The Xiaomi 18 Fold foldable smartphone will be the first device to feature the Xuanwu O3 chip and is expected to launch in September 1. The Xiaomi Pad 9 Pro Max tablet will also adopt this processor 1. The chip delivers significant performance improvements across multiple fronts: its ten-core all-big-core CPU design achieved multi-core benchmark scores exceeding 15,000 points for the first time, representing a 60 percent performance gain 1. The newly debuted G2-Ultra NX graphics processor brings an 85 percent performance increase while reducing power consumption by 64 percent 1. The Xuanwu O3 is the world's first mobile processor to support LPDDR6 memory, offering bandwidth of 113.8 GB/s, a 48 percent improvement over its predecessor, the Xuanwu O1 1. Its neural processing unit delivers 200 TOPS of tensor computing power and 3.13 TFLOPS of vector computing capability, enabling a 45 percent boost in on-device AI performance 1.