芯晓科技推出自研数字电源签核工具IcPower，采用分布式矩阵求解技术，将芯片电源签核周期从几周缩短至几天[1]。该工具的运算速度是国外大厂同类工具的4.5-8.5倍[1]，并支持7nm等先进工艺，可满足百亿门级芯片的电源设计需求[1]。分布式求解技术使电源核签效率提升3-10倍[1]，该工具已在国内多家芯片厂商投入使用[1]。
芯晓科技致力于通过国产替代打造完整的AI驱动芯片设计平台[1]。公司计划在下半年推出热分析和应力分析产品[1]。根据规划，芯晓科技2025年营收达到数百万元[1]，并计划于2026年下半年启动新一轮融资[1]。
Xinciao Tech has unveiled IcPower, a proprietary digital power signoff tool designed to dramatically accelerate chip design workflows.[1] The solution employs a distributed matrix-solving algorithm that reduces power integrity verification cycles from weeks to just days.[1] Processing speeds reach 4.5 to 8.5 times faster than comparable offerings from major international vendors, while the underlying distributed solving technology improves power signoff efficiency by a factor of 3 to 10 times.[1]
The tool supports advanced manufacturing nodes down to 7 nanometers and accommodates power delivery networks for billion-gate-scale chips.[1] IcPower has already been deployed across multiple domestic semiconductor manufacturers, positioning the company's broader strategy toward building a complete AI-driven chip design platform through localized alternatives.[1] Looking ahead, Xinciao Tech projects revenue in the hundreds of millions of yuan for 2025 and plans to initiate a new financing round in the second half of 2026.[1] The company also intends to release thermal analysis and stress analysis products in the latter half of the year.[1]
