日本科学家利用银纳米粒子将DNA组装效率提升至5倍

日本名古屋大学研究团队开发了一种基于银纳米粒子的新型DNA切割与重组技术，相比传统限制酶方法，DNA组装效率提升2至5倍1。该方法通过银纳米粒子产生更长的粘性末端，在50°C条件下1至2小时内DNA切割效率超过91%1，并将DNA回收率从14%大幅提升至98%1。

使用18碱基粘性末端时连接效率达44%，相比传统4碱基末端的8%效率提升5倍1。研究人员成功在人类HeLa细胞中进行了技术验证，组装并表达了绿色荧光蛋白（GFP）1。该研究发表于《核酸研究》2026年第54卷第11期1，由日本科学技术厅（JST）和日本医疗研究开发机构（AMED）资助1。这一技术有望应用于基因治疗、癌症疫苗和转基因农作物等领域1。

Researchers at Nagoya University in Japan have developed a novel method using silver nanoparticles to cut and reassemble DNA, achieving significantly higher efficiency than conventional restriction enzyme techniques 1. The new approach improves DNA assembly efficiency by two to five times compared to traditional methods 1, while simultaneously raising DNA recovery rates from 14 percent to 98 percent 1.

The silver nanoparticle method generates longer sticky ends on DNA strands, which substantially enhances ligation efficiency 1. When using 18-base sticky ends, the ligation efficiency reaches 44 percent—a five-fold improvement over the conventional 4-base end approach, which achieves only 8 percent efficiency 1. The cutting process proves remarkably rapid, with DNA cleavage efficiency exceeding 91 percent within one to two hours at 50 degrees Celsius 1.

The research team successfully demonstrated the practical application of this technology by assembling and expressing green fluorescent protein (GFP) in human HeLa cells 1. The findings, published in Nucleic Acids Research Volume 54, Issue 11 (2026), were supported by funding from the Japan Science and Technology Agency (JST) and the Japan Agency for Medical Research and Development (AMED) 1. This breakthrough holds promise for applications in gene therapy, cancer vaccines, and genetically modified crops 1.