根据泄露文件，苹果在 iPhone 18 Pro 的基带方案上采取了因地制宜的策略1。美版机型将搭载高通 SDX80M 基带以支持 5G 毫米波功能，而国际版本则改用苹果自研的 C2 基带1。为了适配不同基带需求，苹果为 iPhone 18 Pro 设计了两种不同的主板，其中一种配备毫米波连接器，另一种则没有1。
值得关注的是，国行机型有望改变长期以来的 SIM 卡配置方案1。此前所有国行 iPhone 1X Pro 机型均采用双实体 SIM 卡设计，而新机型预计将采用实体 SIM 与 eSIM 的混合配置1。此外，苹果为 iPhone 18 Pro 搭载的 A20 Pro 芯片可能采用晶圆级多芯片模块技术1。苹果 C2 基带预计将延续 C1 和 C1X 基带不支持毫米波的特性1。
According to leaked documents, Apple's upcoming iPhone 18 Pro will feature region-specific modem configurations to optimize connectivity in different markets 1. The U.S. model is expected to use Qualcomm's SDX80M modem to support 5G millimeter-wave technology, while international variants will adopt Apple's self-developed C2 modem 1. The company has designed two distinct logic boards for the device—one equipped with millimeter-wave connectors for the U.S. market and another without these connectors for regions using the C2 modem 1.
The C2 modem is anticipated to share the same limitation as its predecessors, the C1 and C1X modems, in that it will not support millimeter-wave connectivity 1. For the Chinese market, the iPhone 18 Pro is reportedly poised to transition to a hybrid SIM configuration combining a physical nano-SIM slot with eSIM capability, marking a departure from the dual physical SIM setup that has been standard across all Chinese iPhone 1X Pro models 1. Additionally, the A20 Pro chip is expected to employ wafer-level multi-chip module technology for its architecture 1.
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