根据泄露文件，苹果在 iPhone 18 Pro 的基带方案上采取了因地制宜的策略[1]。美版机型将搭载高通 SDX80M 基带以支持 5G 毫米波功能，而国际版本则改用苹果自研的 C2 基带[1]。为了适配不同基带需求，苹果为 iPhone 18 Pro 设计了两种不同的主板，其中一种配备毫米波连接器，另一种则没有[1]。
值得关注的是，国行机型有望改变长期以来的 SIM 卡配置方案[1]。此前所有国行 iPhone 1X Pro 机型均采用双实体 SIM 卡设计，而新机型预计将采用实体 SIM 与 eSIM 的混合配置[1]。此外，苹果为 iPhone 18 Pro 搭载的 A20 Pro 芯片可能采用晶圆级多芯片模块技术[1]。苹果 C2 基带预计将延续 C1 和 C1X 基带不支持毫米波的特性[1]。
According to leaked documents, Apple's upcoming iPhone 18 Pro will feature region-specific modem configurations to optimize connectivity in different markets [1]. The U.S. model is expected to use Qualcomm's SDX80M modem to support 5G millimeter-wave technology, while international variants will adopt Apple's self-developed C2 modem [1]. The company has designed two distinct logic boards for the device—one equipped with millimeter-wave connectors for the U.S. market and another without these connectors for regions using the C2 modem [1].
The C2 modem is anticipated to share the same limitation as its predecessors, the C1 and C1X modems, in that it will not support millimeter-wave connectivity [1]. For the Chinese market, the iPhone 18 Pro is reportedly poised to transition to a hybrid SIM configuration combining a physical nano-SIM slot with eSIM capability, marking a departure from the dual physical SIM setup that has been standard across all Chinese iPhone 1X Pro models [1]. Additionally, the A20 Pro chip is expected to employ wafer-level multi-chip module technology for its architecture [1].
