2025 年 10 月 29 日，国际星闪联盟发布《星闪 SLE3.0 技术标准演进蓝皮书》，显示星闪 SLE 2.0 技术已进入商业落地爆发阶段 1。卓胜微、恒玄、泰凌微、创耀、华为海思等厂商已发布超过 20 款支持该标准的芯片，广泛应用于数字车钥匙和高清音频领域 1。
在汽车领域，2025 年全年搭载星闪数字钥匙的车型总量达 80 余万台，覆盖 10 余家车企；星闪数字车钥匙累计出货超 160 万台，量产车型超 30 款 1。在消费电子方面，华为 FreeBuds Pro 5 和 FreeClip 2 等耳机上市，支持 SLE 2.0 音频功能 1。此外，星闪联盟成员在 2025 年突破 1200 家 1。
The International NearLink Alliance has released the "NearLink SLE 3.0 Technology Standard Evolution Blue Book," indicating that the NearLink SLE 2.0 technology has entered a period of simultaneous maturity and rapid commercial deployment since 2025 1. Core upgrades in this standard include high-definition audio support and high-precision ranging capabilities, which are being actively implemented across various hardware categories 1. Major semiconductor vendors such as Maxscend, Bestechnic, Telink Micro, Cynora, and Huawei HiSilicon have collectively launched more than 20 chip models supporting the NearLink SLE 2.0 standard 1.
In the automotive sector, applications for digital car keys have seen significant growth, with over 800,000 vehicles equipped with NearLink digital keys throughout 2025 1. These deployments cover more than 10 automakers, resulting in cumulative shipments exceeding 1.6 million units across more than 30 mass-produced vehicle models 1. On the consumer electronics front, Huawei Terminal has introduced headphones such as the FreeBuds Pro 5 and FreeClip 2, which leverage the SLE 2.0 audio features 1. The ecosystem supporting these technologies continues to expand, with the number of members in the NearLink Alliance surpassing 1,200 by 2025 1.
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