博主@数码闲聊站爆料称，华为计划于10月28日下午再次发布Mate 90系列手机 1。此次再发布会旨在对前期因发布仓促而未充分披露的“韬定律”等新技术进行详细讲解，被形容为相关技术的“满血回归” 1。回顾此前，华为已于10月1日正式发布Mate 90系列及全场景新品，该系列全系均搭载了基于“韬定律”设计的芯片 1。
在具体配置上，Mate 90标准版搭载麒麟9030旗舰τ芯片，整机性能提升27%，相比上一代麒麟9020，其CPU、GPU和NPU性能分别提升13%、54%和13% 1。Mate 90 Pro首发搭载麒麟9035旗舰τ芯片，整机性能提升20%，较上一代麒麟9030的CPU、GPU和NPU性能分别提升11%、10%和51% 1。高端机型方面，Mate 90 Pro Max/RS配备首款逻辑折叠τ芯片麒麟9050 Pro，支持9核16线程超线程技术，实现整机性能提升31%，多核性能、GPU渲染性能及NPU性能分别提升23%、40%和140%；其中12GB版本的Mate 90 Pro Max则搭载逻辑折叠τ芯片麒麟9050 1。
Huawei is scheduled to hold a press conference on the afternoon of October 28 to re-release the Mate 90 series smartphones 1. This follow-up event comes after the initial launch of the Mate 90 series and full-scenario products on October 1, which featured chips based on "Tao's Law" across the lineup 1. A blogger known as Digital Chat Station indicated that the previous release was rushed and did not fully explain new technical breakthroughs, prompting this second launch to provide detailed insights into technologies such as the "Tao chip," accompanied by warnings of a "full-power return" 1.
The updated presentation will clarify specifications for models equipped with different variants of the Kirin τ chips. The standard Mate 90 features the Kirin 9030 flagship τ chip, delivering a 27% increase in overall performance compared to the previous generation's Kirin 9020, with CPU, GPU, and NPU gains of 13%, 54%, and 13% respectively 1. The Mate 90 Pro introduces the Kirin 9035 flagship τ chip, offering a 20% boost in total system performance over the Kirin 9030, alongside improvements of 11% in CPU, 10% in GPU, and 51% in NPU capabilities 1.
Higher-end models, including the Mate 90 Pro Max and RS, utilize the first logic-folding τ chip, the Kirin 9050 Pro 1. This configuration supports 9-core, 16-thread hyper-threading technology, resulting in a 31% increase in overall performance, with multi-core performance rising by 23%, GPU rendering by 40%, and NPU performance by 140% 1. Additionally, the 12GB version of the Mate 90 Pro Max is equipped with the logic-folding τ chip Kirin 9050 1.
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