Chiphell论坛用户近日分享了AMD一款未曾推出的锐龙9 5900X3D处理器工程样品的信息1。该芯片采用Zen 3微架构，配置12核24线程1，最高频率可达4.85GHz1，热设计功耗为105W1。
这款处理器的突出特点是其独特的缓存设计——配备32MB + 96MB的L3缓存组合1，其中一颗CCD搭载了3D V-Cache技术1。根据曝光的规格，该工程样品代号为100-0000006521，步进版本为B21，兼容SMU版本56.70.0的UEFI1。这是AMD内部探索双CCD X3D产品的测试型号，最终并未在锐龙5000系列中正式推出1。
An engineering sample of AMD's unreleased Ryzen 9 5900X3D processor has been documented by a Chiphell forum user, revealing specifications that hint at the company's internal exploration of dual-chiplet X3D designs within the Ryzen 5000 series 1. The prototype features 12 cores and 24 threads built on Zen 3 architecture, with one core chiplet equipped with 3D V-Cache technology 1.
The engineering sample, designated with part number 100-000000652, carries a distinctive cache configuration pairing 32MB of standard L3 cache with 96MB of 3D V-Cache memory 1. Additional technical details show the processor operates at a maximum frequency of 4.85GHz, maintains a thermal design power rating of 105W, and runs B2 stepping silicon 1. The chip supports UEFI BIOS versions compatible with SMU 56.70.0 and belongs to the Zen 3 Vermeer processor family 1. Although this dual-chiplet X3D variant was apparently tested internally, it never materialized as an official release in the Ryzen 5000 product lineup 1.
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