荣耀 Magic9 Pro Max 支持双实体卡 + 双 eSIM 融合架构

荣耀官方宣布，荣耀 Magic9 Pro Max 手机将采用「双实体卡 + 双 eSIM」融合架构，支持安装四张 SIM 卡，并可实现双号同时在线 1。该系列手机将于 9 月 28 日发布 1。

在硬件配置方面，Magic9 Pro Max 搭载自研至臻黑钻屏，采用 5600 层氮化硅镀膜工艺，屏幕反射率降至 1.5% 1；配备骁龙 8 Elite 处理器 1，6.8 英寸 2868×1320 像素 1.5K+ 分辨率直屏，支持 120Hz LTPO 自适应刷新率 1。电池方面，该机搭载 8800mAh 容量电池，支持 100W 有线充电和 80W 无线充电 1。相机配置上，后置采用 200MP 主摄，传感器尺寸为 1/1.28 英寸，光圈值 F1.57 1。此外，该机通过 IP68、IP69 和 IP69K 防水防尘等级认证 1。

Honor has announced that its upcoming Magic9 Pro Max smartphone will support a "dual physical SIM + dual eSIM" hybrid architecture, enabling users to install four SIM cards with dual numbers active simultaneously 1. The device can switch between all four cards freely while maintaining connectivity across two numbers at the same time 1.

The Magic9 series is scheduled to launch on September 28 1. The Pro Max variant will come equipped with flagship specifications including Honor's proprietary Zenith Black Diamond display featuring a 5600-layer silicon nitride coating that reduces reflectance to just 1.5% 1. The device is powered by the Snapdragon 8 Elite processor (sixth-generation Snapdragon 8 Supreme Edition) and features an 8800mAh battery with 100W wired charging and 80W wireless charging capabilities 1. The 6.8-inch display offers 2868 x 1320 resolution at 1.5K+ with 120Hz LTPO refresh rate 1, while the rear camera system includes a 200-megapixel primary sensor with a 1/1.28-inch sensor size and f/1.57 aperture 1. The phone also carries an IP68/69/69K water and dust resistance rating 1.